本期继续介绍PCB设计的后期处理方法ICT设计，那么ICT测试点焊盘的设计与普通过孔或表贴焊盘有什么区别？
[backcolor=#0d0c0c]ICT添加前期准备[/backcolor]
[backcolor=#ffffff]1.进入ICT添加设计界面 manufacture/testprep/automatic 就会出现下面界面[/backcolor]
[attachment=382955]

[backcolor=#ffffff]2.进入测试点参数设计界面，进入上面的操作界面后直接点parameters就出现下面的界面[/backcolor]
[attachment=382956]


[backcolor=#ffffff]3.测试点焊盘的选择[/backcolor]
[attachment=382957]


[backcolor=#ffffff]4.测试点间距的设置[/backcolor]
[attachment=382958]


[backcolor=#0d0c0c]自动添加ICT[/backcolor]
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[/backcolor]
[attachment=382958]
[backcolor=#0d0c0c]手动添加ICT[/backcolor]
[backcolor=#ffffff]进入ICT添加设计界面manufacture—testprep--manual。。设计界面右边就会出现下面界面：[/backcolor]


[attachment=382959]


[backcolor=#ffffff]PS：手动添加测试点时，一般我们是添加一个网络，低亮一个[/backcolor]
[backcolor=#ffffff]板上显示测试点[/backcolor]
[backcolor=#ffffff]点击color192图标，进入下面选项：[/backcolor]
[attachment=382960]


[backcolor=#ffffff]效果图如下：[/backcolor]
[attachment=382961]


[backcolor=#ffffff]以上便是PCB设计后期处理之ICT设计[/backcolor]
[backcolor=#ffffff]下期预告：[/backcolor][backcolor=#ffffff]丝印要求及摆放[/backcolor]
[backcolor=#ffffff]请同学们持续关注【[/backcolor][backcolor=#ffffff]快点儿PCB学院[/backcolor][backcolor=#ffffff]】公众号[/backcolor]